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IPC 8497-1Cleaning Methods and Contamination Assessment for Optical Assemblystandard by Association Connecting Electronics Industries, 01/01/2006
IPC HDBK-005Guide to Solder Paste AssessmentHandbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2006
IPC J-STD-006BRequirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applicationsstandard by Association Connecting Electronics Industries, 01/01/2006
IPC 4412ASpecification for Finished Fabric Woven from "E" Glass for Printed Boardsstandard by Association Connecting Electronics Industries, 01/01/2006
IPC 9701APerformance Test Methods and Qualification Requirements for Surface Mount Solder Attachmentsstandard by Association Connecting Electronics Industries, 02/01/2006
IPC JP002JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guidelinestandard by Association Connecting Electronics Industries, 03/01/2006
IPC 6013AQualification and Performance Specification for Flexible Printed Boards, Includes Amendment 2standard by Association Connecting Electronics Industries, 04/01/2006
IPC 9591Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devicesstandard by Association Connecting Electronics Industries, 04/01/2006
IPC TR 585Time, Temperature and Humidity Stress of Final Board Finish Solderabilitystandard by Association Connecting Electronics Industries, 05/01/2006
IPC 4821Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boardsstandard by Association Connecting Electronics Industries, 05/01/2006
IPC 4101BSpecifications for Base Materials for Rigid and Multilayer Printed Boards, Includes Amendments No. 1 and No. 2 (2007)standard by Association Connecting Electronics Industries, 06/01/2006
IPC 4761Design Guide for Protection of Printed Board Via StructuresHandbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2006