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IPC 9194Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guidelinestandard by Association Connecting Electronics Industries, 09/01/2004
IPC DRM-SMT-DSurface Mount Solder Joint Evaluation - Desk Reference ManualHandbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2005
IPC 6013AQualification and Performance Specification for Flexible Printed Boards, Includes Amendment 1standard by Association Connecting Electronics Industries, 01/01/2005
IPC 7095ADesign and Assembly Process Implementation for BGAsstandard by Association Connecting Electronics Industries, 01/01/2005
IPC 9704Printed Wiring Board Strain Gage Test Guidelinestandard by Association Connecting Electronics Industries, 06/01/2005
IPC J-STD-001DRequirements for Soldered Electrical and Electronic Assembliesstandard by Association Connecting Electronics Industries, 02/01/2005
IPC A-610DAcceptability of Electronic Assembliesstandard by Association Connecting Electronics Industries, 02/01/2005
IPC 4553Specification for Immersion Silver Plating for Printed Circuit Boardsstandard by Association Connecting Electronics Industries, 06/01/2005
IPC J-STD-030Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackagesstandard by Association Connecting Electronics Industries, 09/01/2005
IPC HDBK-001Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001BHandbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2005
IPC J-STD-033BHandling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)standard by Association Connecting Electronics Industries, 10/01/2005
IPC WP-008Setting Up Ion Chromatography Capabilitystandard by Association Connecting Electronics Industries, 12/01/2005