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IPC J-STD-020DMoisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devicesstandard by Association Connecting Electronics Industries, 08/01/2007
IPC 9201ASurface Insulation Resistance Handbookstandard by Association Connecting Electronics Industries, 09/01/2007
IPC 4563Resin Coated Copper Foil for Printed Boards Guidelinestandard by Association Connecting Electronics Industries, 11/01/2007
IPC 7711/7721BRework, Modification and Repair of Electronic Assembliesstandard by Association Connecting Electronics Industries, 11/01/2007
IPC J-STD-002CSolderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008)standard by Association Connecting Electronics Industries, 12/01/2007
IPC DRM-18HComponent Identification Training and Reference Guidestandard by Association Connecting Electronics Industries, 12/01/2007
IPC 7095BDesign and Assembly Process Implementation for BGAsstandard by Association Connecting Electronics Industries, 03/01/2008
IPC J-STD-020D-1Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devicesstandard by Association Connecting Electronics Industries, 03/01/2008
IPC 4781Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inkstandard by Association Connecting Electronics Industries, 05/01/2008
IPC 2223BSectional Design Standard for Flexible Printed Boardsstandard by Association Connecting Electronics Industries, 05/01/2008
IPC 4562AMetal Foil for Printed Board Applicationsstandard by Association Connecting Electronics Industries, 05/01/2008
IPC 4811Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boardsstandard by Association Connecting Electronics Industries, 05/01/2008