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IPC 0040Optoelectronics Assembly and Packaging Technologystandard by Association Connecting Electronics Industries, 05/01/2003
IPC 2226Sectional Design Standard for High Density Interconnect (HDI) Boardsstandard by Association Connecting Electronics Industries, 05/01/2003
IPC 2221AGeneric Standard on Printed Board Designstandard by Association Connecting Electronics Industries, 05/01/2003
IPC 5701Users Guide for Cleanliness of Unpopulated Printed Boardsstandard by Association Connecting Electronics Industries, 07/01/2003
IPC 2501Definition for Web-Based Exchange of XML Datastandard by Association Connecting Electronics Industries, 07/01/2003
IPC EMBPAS03IPC International Conference on Embedded Passives "The Faster and Cleaner Electronic Signals for the Future" - Northbrook, IL - June 2003Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
IPC LDFR0603IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium - June 2003)Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
IPC WP-006Round Robin Testing & Analysis: Lead-Free Alloys Tin, Silver, & Copperstandard by Association Connecting Electronics Industries, 07/01/2003
IPC 7711/21ARework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assembliesstandard by Association Connecting Electronics Industries, 10/01/2003
IPC 2251Design Guide for the Packaging of High Speed Electronic CircuitsHandbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003
IPC 4411ASpecification and Characterization Methods for Nonwoven Para-Aramid Reinforcementstandard by Association Connecting Electronics Industries, 11/01/2003
IPC T-50GTerms and Definitions for Interconnecting and Packaging Electronic Circuitsstandard by Association Connecting Electronics Industries, 12/01/2003