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IPC HDBK-001EHandbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001BHandbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012
IPC JEDEC-9704APrinted Circuit Assembly Strain Gage Test Guidelinestandard by Association Connecting Electronics Industries, 02/01/2012
IPC AJ-820AAssembly & Joining HandbookHandbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/2012
IPC J-STD-033CHandling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)standard by Association Connecting Electronics Industries, 02/01/2012
IPC J-STD-005ARequirements for Soldering Pastesstandard by Association Connecting Electronics Industries, 02/01/2012
IPC 4554-WAM1Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1standard by Association Connecting Electronics Industries, 01/01/2012
IPC 4103ASpecification for Base Materials for High Speed/High Frequency Applicationsstandard by Association Connecting Electronics Industries, 12/01/2011
IPC 9850ASurface Mount Placement Equipment Characterizationstandard by Association Connecting Electronics Industries, 11/01/2011
IPC 6018BMicrowave End Product Board Inspection and Teststandard by Association Connecting Electronics Industries, 11/01/2011
IPC 2223CSectional Design Standard for Flexible Printed Boardsstandard by Association Connecting Electronics Industries, 11/01/2011
IPC 7525BStencil Design Guidelinesstandard by Association Connecting Electronics Industries, 10/01/2011
IPC T-50JTerms and Definitions for Interconnecting and Packaging Electronic Circuitsstandard by Association Connecting Electronics Industries, 10/01/2011