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IPC 4554 Amendment 1Amendment 1 to Specification for Immersion Tin Plating for Printed Circuit BoardsAmendment by Association Connecting Electronics Industries, 08/01/2012
IPC 1758Declaration Requirements for Shipping, Pack and Packing Materials.standard by Association Connecting Electronics Industries, 07/01/2012
IPC HDBK-850Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assemblystandard by Association Connecting Electronics Industries, 07/01/2012
IPC 4552 Amendment 1Amendment 1 to Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit BoardsAmendment by Association Connecting Electronics Industries, 06/01/2012
IPC A-620ASSpace Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance for Cable and Wire Harness AssembliesAmendment by Association Connecting Electronics Industries, 06/01/2012
IPC 4921Requirements for Printed Electronics Base Materials (Substrates)standard by Association Connecting Electronics Industries, 06/01/2012
IPC 4204AFlexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitrystandard by Association Connecting Electronics Industries, 05/31/2012
IPC 9203Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehiclestandard by Association Connecting Electronics Industries, 05/01/2012
IPC 9151DProcess Capability, Quality and Relative Reliability (PQCR2) Benchmark Test Standard and Databasestandard by Association Connecting Electronics Industries, 05/01/2012
IPC 7527Requirements for Solder Paste Printingstandard by Association Connecting Electronics Industries, 05/01/2012
IPC 2581Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodologystandard by Association Connecting Electronics Industries, 05/01/2012
IPC J-STD-004B-WAM1Requirements for Soldering Fluxesstandard by Association Connecting Electronics Industries, 02/28/2012