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IPC 9641High Temperature Printed Board Flatness Guidelinestandard by Association Connecting Electronics Industries, 06/01/2013
IPC 4412BSpecification for Finished Fabric Woven from "E" Glass for Printed Boardsstandard by Association Connecting Electronics Industries, 05/01/2013
IPC 5703Cleanliness Guidelines for Printed Board Fabricatorsstandard by Association Connecting Electronics Industries, 05/01/2013
IPC 4203ACover and Bonding Material for Flexible Printed Circuitrystandard by Association Connecting Electronics Industries, 01/01/2013
IPC 7095CDesign and Assembly Process Implementation for BGAsstandard by Association Connecting Electronics Industries, 01/01/2013
IPC 4556Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boardsstandard by Association Connecting Electronics Industries, 01/01/2013
IPC 4552-WAM1-2Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2standard by Association Connecting Electronics Industries, 12/01/2012
IPC 4591Requirements for Printed Electronics Functional Conductive Materialsstandard by Association Connecting Electronics Industries, 11/01/2012
IPC 1751A(D)FGeneric Requirements for Declaration Process Management, Includes Amendment 1Amendment by Association Connecting Electronics Industries, 11/01/2012
IPC 9592BRequirements for Power Conversion Devices for the Computer and Telecommunications Industriesstandard by Association Connecting Electronics Industries, 11/01/2012
IPC 2221BGeneric Standard on Printed Board Designstandard by Association Connecting Electronics Industries, 11/01/2012
IPC A-620BRequirements and Acceptance for Cable and Wire Harness Assemblies with Amendment 1standard by Association Connecting Electronics Industries, 10/01/2012