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IPC QE-605APrinted Board Quality Evaluation Handbookstandard by Association Connecting Electronics Industries, 02/01/1999
IPC EXPO-99IPC Printed Circuits Expo 99 Proceedingsstandard by Association Connecting Electronics Industries, 03/01/1999
IPC 4411Specification and Characterization Methods for Non-Woven Para-aramid Reinforcementstandard by Association Connecting Electronics Industries, 04/01/1999
IPC 9502PWB Assembly Soldering Process Guideline for Electronic Componentsstandard by Association Connecting Electronics Industries, 04/01/1999
IPC 9503Moisture Sensitivity Classification for Non-IC Componentsstandard by Association Connecting Electronics Industries, 04/01/1999
IPC J-STD-026Semiconductor Design Standard for Flip Chip Applicationsstandard by Association Connecting Electronics Industries, 04/01/1999
IPC J-STD-028Performance Standard fo Construction of Flip Chip and Chip Scale Bumpsstandard by Association Connecting Electronics Industries, 04/01/1999
IPC J-STD-033Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devicesstandard by Association Connecting Electronics Industries, 04/01/1999
IPC J-STD-035Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Componentsstandard by Association Connecting Electronics Industries, 04/01/1999
IPC J-STD-020AMoisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devicesstandard by Association Connecting Electronics Industries, 04/01/1999
IPC 6016Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boardsstandard by Association Connecting Electronics Industries, 05/01/1999
IPC 4104Specifications for High Density Interconnect (HDI) and Microvia Materialsstandard by Association Connecting Electronics Industries, 05/01/1999