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IPC 2225Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)standard by Association Connecting Electronics Industries, 05/01/1998
IPC 9504Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)standard by Association Connecting Electronics Industries, 06/01/1998
IPC 4110Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boardsstandard by Association Connecting Electronics Industries, 08/01/1998
IPC 4130Specification and Characterization Methods for Nonwoven "E" Glass Materialsstandard by Association Connecting Electronics Industries, 09/01/1998
Resin Coated Metal Foil for Printed BoardsBook by Association Connecting Electronics Industries, 09/01/1998
IPC EAE-98Electronics Assembly Expo 1998standard by Association Connecting Electronics Industries, 11/01/1998
IPC TP-1115Selection and Implementation Strategy for a Low-Residue, No-Clean Processstandard by Association Connecting Electronics Industries, 12/01/1998
IPC TMRC99RTMRC 1999 Market for Flexible Circuits - TMRC99FReport / Survey by Association Connecting Electronics Industries, 01/01/1999
IPC BET-99National Conference on Bare Board and Advanced Substrate Electrical Test: HDI's Holy Grail ProceedingsConference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC FLEX-CO-99IPC National Conference Flexible Circuits Volume I & II - Denver, CO 1999Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999
IPC CH-65AGuidelines for Cleaning of Printed Boards and AssembliesHandbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1999
IPC 2524PWB Fabrication Data Quality Rating Systemstandard by Association Connecting Electronics Industries, 02/01/1999