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IEC 60191-6-2 Ed. 1.0 en CORR1:2002
M00027185
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IEC 60191-6-2 Ed. 1.0 en CORR1:2002 Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Corrigenda by International Electrotechnical Commission, 10/18/2002
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