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IPC SG-141Specification for Finished Fabric Woven from "S" Glass for Printed Boardsstandard by Association Connecting Electronics Industries, 02/01/1992
IPC J-STD-003Solderability Tests for Printed Boardsstandard by Association Connecting Electronics Industries, 04/01/1992
IPC FA-251Guidelines for Assembly of Single-Sided and Double-Sided Flexible Printed CircuitsHandbook / Manual / Guide by Association Connecting Electronics Industries, 02/01/1992
IPC QF-143Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boardsstandard by Association Connecting Electronics Industries, 02/01/1992
IPC D-330Design Guide ManualHandbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1992
IPC D-310CGuidelines for Phototool Generation and Measurement TechniquesHandbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/1991
IPC TR-483Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs - Includes addenda I and IIstandard by Association Connecting Electronics Industries, 03/01/1991
IPC SM-784Guidelines for Chip-on-Board Technology Implementationstandard by Association Connecting Electronics Industries, 11/01/1990
IPC MB-380Guidelines for Molded Interconnection DevicesHandbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/1990
IPC ET-652Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boardsstandard by Association Connecting Electronics Industries, 10/01/1990
IPC A-142Specification for Finished Fabric Woven from Aramid for Printed Boardsstandard by Association Connecting Electronics Industries, 06/01/1990
IPC L-108B [ Withdrawn ]Specification for Thin Metal Clad Base Materials for Multilayer Printed Boardsstandard by Association Connecting Electronics Industries, 06/01/1990