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Composite Metallic Material Specification for Printed Wiring BoardsBook by Association Connecting Electronics Industries, 01/01/1994
IPC OI-645Standard for Visual Optical Inspection Aidsstandard by Association Connecting Electronics Industries, 10/01/1993
IPC TR-551Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Componentsstandard by Association Connecting Electronics Industries, 07/01/1993
IPC MS-810Guidelines for High Volume Microsectionstandard by Association Connecting Electronics Industries, 10/01/1993
IPC S-816SMT Process Guideline and Checkliststandard by Association Connecting Electronics Industries, 07/01/1993
IPC TR-465-1Round Robin Test on Steam Ager Temperature Control Stabilitystandard by Association Connecting Electronics Industries, 01/01/1993
IPC TR-465-2The Effect of Steam Aging Time and Temperature on Solderability Test Resultsstandard by Association Connecting Electronics Industries, 01/01/1993
IPC SM-785Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachmentsstandard by Association Connecting Electronics Industries, 11/01/1992
IPC TP-104-KCleaning & Cleanliness Test Program, Phase 3, Water Soluble Fluxes Parts 1 and 2Report / Survey by Association Connecting Electronics Industries, 10/01/1992
IPC FC-232C [ Withdrawn ]Specification for Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiringstandard by Association Connecting Electronics Industries, 08/01/1992
IPC MC-790Guidelines for Multichip Module Technology Utilizationstandard by Association Connecting Electronics Industries, 08/01/1992
IPC D-350DPrinted Board Description in Digital Formstandard by Association Connecting Electronics Industries, 07/01/1992