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JIS C 60068-2-69:2019 outlines test Te (Solderability testing of printed board) and test Tc [Solderability testing by balancing method, with assessment based on quantitative assessment criteria (wetting time and wettability)], the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations on electronic components and printed boards. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.

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Published: 01/01/2019 Number of Pages: 61 File Size: 1 file , 640 KB