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IPC 9850

M00000091

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IPC 9850 Surface Mount Placement Equipment Characterization

standard by Association Connecting Electronics Industries, 07/01/2002

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This standard has been developed to standardize the parameters, measurement procedures, and the methodologies used for the specification, evaluation, and continuing verification of assembly equipment characterization parameters. It establishes the procedures to characterize and document machine placement capability of surface mount assembly equipment while maintaining a placement accuracy to placement speed relationship. Kit includes one printed copy of the standard and a CD with the support spreadsheet, forms and the drawing files (Gerber format) necessary to make the test materials (these are not read-only).