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BS 11/30248240 DC
M00000028
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BS 11/30248240 DC BS EN 60191-6-22. Mechanical standardization of semiconductor devices. Part 6-22. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages. Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array
standard by BSI Group, 06/02/2011
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Cross References:
IEC 60191-6
All current amendments available at time of purchase are included with the purchase of this document.