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BS 10/30211454 DC
M00000549
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BS 10/30211454 DC BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures
standard by BSI Group, 02/22/2010
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Cross References:
IEC 62047-2
All current amendments available at time of purchase are included with the purchase of this document.