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BS 4584-103.1:1990
M00000085
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BS 4584-103.1:1990 Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
standard by BSI Group, 02/28/1990
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Two types of epoxide resin impregnated woven glass fabric with the resin cured to B stage.Cross References:
BS 4584:Part 1