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BS 08/30190030 DC
M00000270
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BS 08/30190030 DC BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
standard by BSI Group, 12/01/2008
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Cross References:
IEC 60191-4
IEC 60191-6
All current amendments available at time of purchase are included with the purchase of this document.