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BS 5660-2:2001Methods of sampling iron ores. Sampling and sample preparation proceduresstandard by BSI Group, 07/15/2001
BS PD ES 59008-5-1:2001Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare diestandard by BSI Group, 07/15/2001
BS HB 10190:2001IMS: The framework (Integrated Management Systems Series)Handbook / Manual / Guide by BSI Group, 07/15/2001
BS PD IEC/PAS 62240:2001Use of semiconductor devices outside manufacturer's specified temperature rangesstandard by BSI Group, 07/15/2001
BS 01/205138 DCIEC 61249-4-1. Ed.1. Materials for printed boards and other interconnecting structures. Part 4: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Section 1: Epoxide woven E-glass prepreg of defined flammability (vertical burning test). Section 1:...
BS 01/710230 DCISO/DPAS 15594.3. Airport hydrogen fuelling facilitystandard by BSI Group, 07/06/2001
BS 11/30230626 DCBS ISO 14824-1. Grout for prestressing tendons. Part 1. Basic requirementsstandard by BSI Group, 07/08/2001
BS 01/205114 DCISO/DIS 15075. Transport information and control systems. In-vehicle navigation systems. Communications message set requirementsstandard by BSI Group, 07/10/2001
BS DISC PD 0012-6:2001Data protection. Guide to data controller and data processor contractsstandard by BSI Group, 07/06/2001
BS 01/122636 DCRubber compounding ingredients. Carbon black. Determination of dibutyl phthalate absorption number for loose and compressed samplesstandard by BSI Group, 07/05/2001
BS HB 10214:2001Sustainable Practices in the Built EnvironmentHandbook / Manual / Guide by BSI Group, 06/25/2001
BS 01/709648 DCprEN 4165-011. Aerospace series. Connectors, electrical, rectangular, modular. Operating temperature 175 degreesC continuous. Part 011: Flange mounting receptacle 2 or 4 modules, series 2. Product standardstandard by BSI Group, 06/21/2001