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IPC J-STD-001GRequirements for Soldered Electrical and Electronic Assembliesstandard by Association Connecting Electronics Industries, 10/31/2017
IPC 9505Guideline Methodology for Assessing Component and Cleaning Materials Compatibilitystandard by Association Connecting Electronics Industries, 09/27/2017
IPC 6012D-WAM1Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1standard by Association Connecting Electronics Industries, 09/01/2017
IPC 6012D-AM1Amendment 1 to IPC-6012D, Qualification and Performance Specification for Rigid Printed BoardsAmendment by Association Connecting Electronics Industries, 09/01/2017
IPC 2226ASectional Design Standard for High Density Interconnect (HDI) Printed Boardsstandard by Association Connecting Electronics Industries, 09/01/2017
IPC J-STD-003C-WAM1&2Solderability Tests for Printed Boards with Amendment 1&2standard by Association Connecting Electronics Industries, 09/01/2017
IPC 6013DQualification and Performance Specification for Flexible/Rigid-Flexible Printed Boardsstandard by Association Connecting Electronics Industries, 09/01/2017
IPC 4552APerformance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boardsstandard by Association Connecting Electronics Industries, 08/01/2017
IPC A-640Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assembliesstandard by Association Connecting Electronics Industries, 07/01/2017
IPC 7091Design and Assembly Process Implementation of 3D Componentsstandard by Association Connecting Electronics Industries, 06/01/2017
IPC 1755 WAM1&2Conflict Minerals Data Exchange StandardAmendment by Association Connecting Electronics Industries, 05/08/2017
IPC 4921ARequirements for Printed Electronics Base Materials (Substrates)standard by Association Connecting Electronics Industries, 05/01/2017