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Resin Coated Metal Foil for Printed BoardsBook by Association Connecting Electronics Industries, 09/01/1998
IPC 4130Specification and Characterization Methods for Nonwoven "E" Glass Materialsstandard by Association Connecting Electronics Industries, 09/01/1998
IPC 4110Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boardsstandard by Association Connecting Electronics Industries, 08/01/1998
IPC 9504Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)standard by Association Connecting Electronics Industries, 06/01/1998
IPC 2225Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)standard by Association Connecting Electronics Industries, 05/01/1998
IPC VT-89Bare Board Electrical Test - VIDEOstandard by Association Connecting Electronics Industries, 04/01/1998
IPC 7711/7721Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assembliesstandard by Association Connecting Electronics Industries, 04/01/1998
IPC 2222Sectional Standard on Rigid PWB Designstandard by Association Connecting Electronics Industries, 03/01/1998
IPC 6015Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structuresstandard by Association Connecting Electronics Industries, 02/01/1998
IPC 2224Standard for Design of Printed Wiring Boards for PCMCIAsstandard by Association Connecting Electronics Industries, 01/01/1998
IPC HDIS-98HDIS 1998 Conference ProceedingsConference Proceeding by Association Connecting Electronics Industries, 01/01/1998
IPC TP-1114The Layman's Guide to Qualifying a Process to J-STD-001Handbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/1998