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IPC 9701APerformance Test Methods and Qualification Requirements for Surface Mount Solder Attachmentsstandard by Association Connecting Electronics Industries, 02/01/2006
IPC 4412ASpecification for Finished Fabric Woven from "E" Glass for Printed Boardsstandard by Association Connecting Electronics Industries, 01/01/2006
IPC J-STD-006BRequirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applicationsstandard by Association Connecting Electronics Industries, 01/01/2006
IPC HDBK-005Guide to Solder Paste AssessmentHandbook / Manual / Guide by Association Connecting Electronics Industries, 01/01/2006
IPC 8497-1Cleaning Methods and Contamination Assessment for Optical Assemblystandard by Association Connecting Electronics Industries, 01/01/2006
IPC WP-008Setting Up Ion Chromatography Capabilitystandard by Association Connecting Electronics Industries, 12/01/2005
IPC J-STD-033BHandling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices, Includes Amendment 1 (2007)standard by Association Connecting Electronics Industries, 10/01/2005
IPC HDBK-001Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001BHandbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2005
IPC J-STD-030Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackagesstandard by Association Connecting Electronics Industries, 09/01/2005
IPC 4553Specification for Immersion Silver Plating for Printed Circuit Boardsstandard by Association Connecting Electronics Industries, 06/01/2005
IPC 9704Printed Wiring Board Strain Gage Test Guidelinestandard by Association Connecting Electronics Industries, 06/01/2005
IPC A-610DAcceptability of Electronic Assembliesstandard by Association Connecting Electronics Industries, 02/01/2005