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IPC 6012DSSpace and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed BoardsAmendment by Association Connecting Electronics Industries, 2015
IPC WP-1081White Paper on Conflict Minerals Due Diligence Guidancestandard by Association Connecting Electronics Industries, 07/01/2015
IPC 4101ESpecification for Base Materials for Rigid and Multilayer Printed Boardsstandard by Association Connecting Electronics Industries, 07/01/2015
IPC 4101D-WAM1Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1standard by Association Connecting Electronics Industries, 07/01/2015
IPC 6901Application Categories for Printed Electronicsstandard by Association Connecting Electronics Industries, 07/01/2015
IPC T-50MTerms and Definitions for Interconnecting and Packaging Electronic Circuitsstandard by Association Connecting Electronics Industries, 05/01/2015
IPC 9702-WAM1Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1standard by Association Connecting Electronics Industries, 05/01/2015
IPC 7801Reflow Oven Process Control Standardstandard by Association Connecting Electronics Industries, 03/01/2015
IPC 7092Design and Assembly Process Implementation for Embedded Componentsstandard by Association Connecting Electronics Industries, 02/01/2015
IPC J-STD-001FSSpace Applications Electronic Hardware Addendum to J-STD-001FAmendment by Association Connecting Electronics Industries, 2015
IPC J-STD-020EMoisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devicesstandard by Association Connecting Electronics Industries, 01/01/2015
IPC SM-817AGeneral Requirements for Dielectric Surface Mounting Adhesivesstandard by Association Connecting Electronics Industries, 12/01/2014