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Silicon Wafer Bonding Technology for VLSI and MEMS Applications
M00000287
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The use of silicon-on-insulator (SOI) technology in microelectronics is proliferating and is ready to be applied in a growing number of IC fabrication situations. Bonding of single crystal Si to dielectrics, normally silicon dioxide, is a key method of producing SOI structures and this book is designed to directly assist engineers in applying emerging SOI technology in practice.
Book DOI:10.1049/PBEP001E
Chapter DOI:10.1049/PBEP001E
ISBN: 9780852960394
e-ISBN: 9781849193702
Page count: 175
Format: PDF