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IEC 61300-1 Ed. 3.0 b:2011 [ Withdrawn ]Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 1: General and guidancestandard by International Electrotechnical Commission, 03/23/2011
IEC 60364-7-718 Ed. 1.0 b:2011Low-voltage electrical installations - Part 7-718: Requirements for special installations or locations - Communal facilities and workplacesstandard by International Electrotechnical Commission, 03/23/2011
IEC 62359 Ed. 2.0 b CORR1:2011Corrigendum 1 - Ultrasonics - Field characterization - Test methods for the determination of thermal and mechanical indices related to medical diagnostic ultrasonic fieldsCorrigenda by International Electrotechnical Commission, 03/15/2011
IEC 60512-26-100 Amd.1 Ed. 1.0 b:2011Amendment 1 - Connectors for electronic equipment - Tests and measurements - Part 26-100: Measurement setup, test and reference arrangements and measurements for connectors according to IEC 60603-7 - Tests 26a to 26gAmendment by International Electrotechnical...
IEC 60838-1 Amd.2 Ed. 4.0 b:2011 [ Withdrawn ]Amendment 2 - Miscellaneous lampholders - Part 1: General requirements and testsAmendment by International Electrotechnical Commission, 03/14/2011
IEC 60793-2-10 Ed. 4.0 b:2011 [ Withdrawn ]Optical fibres - Part 2-10: Product specifications - Sectional specification for category A1 multimode fibresstandard by International Electrotechnical Commission, 03/14/2011
IEC 60745-2-22 Ed. 1.0 b:2011Hand-held motor-operated electric tools - Safety - Part 2-22: Particular requirements for cut-off machinesstandard by International Electrotechnical Commission, 03/14/2011
IEC 60679-6 Ed. 1.0 b:2011 [ Withdrawn ]Quartz crystal controlled oscillators of assessed quality - Part 6: Phase jitter measurement method for quartz crystal oscillators and SAW oscillators - Application guidelinesstandard by International Electrotechnical Commission, 03/14/2011
IEC 60191-5 Ed. 2.0 b:1997Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)standard by International Electrotechnical Commission, 04/23/1997
IEC 60748-4 Ed. 2.0 b:1997Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuitsstandard by International Electrotechnical Commission, 04/23/1997
IEC 61319-2 Ed. 1.0 b:1997Interconnections of satellite receiving equipment - Part 2: Japanstandard by International Electrotechnical Commission, 04/23/1997
IEC 60662 Amd.9 Ed. 1.0 b:1997 [ Withdrawn ]Amendment 9 - High-pressure sodium vapour lampsAmendment by International Electrotechnical Commission, 04/16/1997